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The third generation semiconductor device technology application seminar focused on the application of silicon carbide in the new energy field

Time: 2024-04-25

On April 25, 2024, the "Hetao Application Innovation Technology Series Salon (First Phase) Third Generation Semiconductor Device Technology Application Seminar" hosted by Shenzhen Bay Area Station Innovation Technology Service Co., Ltd., co-organized by the Hong Kong Applied Science and Technology Research Institute, and undertaken by Greater Bay Area Capital Co., Ltd. was successfully held today.

This seminar invited our founder and CEO Mr. Tan Zhiming as a guest speaker, who gave a wonderful presentation on the application of silicon carbide (SiC) in new energy vehicles and other fields.

Silicon carbide is expected to become a key material for new energy vehicles

Mr. Tan Zhiming said that compared with traditional silicon-based semiconductor materials, silicon carbide has excellent properties such as high temperature resistance, high voltage, and low loss, and has broad application prospects in the power electronic systems of new energy vehicles.

He pointed out that silicon carbide power devices can significantly reduce the power loss of the motor control system of new energy vehicles, improve energy conversion efficiency, and thus extend the driving range. At the same time, silicon carbide devices are smaller in size and lighter in weight, which helps to reduce the weight of the entire vehicle.

In addition, silicon carbide devices can also be used in the on-board charging systems and off-board charging piles of new energy vehicles to shorten charging time and improve user experience.

Zhongzeng Semiconductor targets the field of silicon carbide etching equipment

As a high-tech enterprise focusing on the development of etching equipment and special processes, Zhongzeng Semiconductor is developing advanced plasma dry etching equipment and silicon carbide trench "SiC-Trench-Etch" process solutions to help the development of the silicon carbide industry.

Mr. Tan Zhiming said that Zhongzhen Semiconductor will work with industry partners to promote the application of plasma dry etching technology in a wider range of fields and provide customers with full-process services such as process implementation, mass production and yield improvement.

Representatives of the Hong Kong Applied Science and Technology Research Institute highly praised the professionalism and innovative strength of the Zhongzheng Semiconductor team at the meeting, and looked forward to more cooperation between the two sides in cutting-edge technology fields such as silicon carbide.

The guests at the meeting agreed that the third-generation semiconductor materials are penetrating at an accelerated pace, and silicon carbide, as a leader among them, will surely inject new impetus into emerging industries.

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